| 发明名称 | MEMS package | ||
| 摘要 | A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication. | ||
| 申请公布号 | US9012255(B1) | 申请公布日期 | 2015.04.21 |
| 申请号 | US201314060716 | 申请日期 | 2013.10.23 |
| 申请人 | DunAn Microstaq, Inc. | 发明人 | Arunasalam Parthiban;Ojeda, Sr. Joe Albert |
| 分类号 | H01L21/00;B81C1/00;H01L29/00;B01L3/00 | 主分类号 | H01L21/00 |
| 代理机构 | MacMillan, Sobanski & Todd, LLC | 代理人 | MacMillan, Sobanski & Todd, LLC |
| 主权项 | 1. A method of manufacturing a MEMS package comprising: a) providing a multi-layer substrate formed of a first material, said substrate defining a bore through each layer, the bore having a fluid filter therein, the filter disposed within the multi-layer substrate; b) substantially completely lining said bore through its entire length with a second material that is different from said first material; and c) affixing a micromachined component having a fluid passageway formed therein to said substrate such that said bore and said fluid passageway are in fluid communication. | ||
| 地址 | Austin TX US | ||