Chip package and a method of manufacturing the same

摘要

In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip.

主权项

1. A chip package, comprising:
at least one chip comprising a plurality of pressure sensor regions; and encapsulation material encapsulating and forming a seal against the chip; wherein at least one pressure sensor region comprises:
a pressure measuring inlet structure configured to receive a fluid supply structure,a sealing structure configured to form a seal between the encapsulation and the fluid supply structure, andan enclosed cavity under the sealing structure, wherein the encapsulation material forms at least part of the side walls of the enclosed cavity.