Laminated electronic component and manufacturing method therefor

摘要

A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.

主权项

1. A laminated electronic component comprising:
a component main body having a stack structure and including a plurality of internal electrodes provided therein, each of the plurality of internal electrodes including exposed surfaces; and an external terminal electrode electrically connected to the plurality of internal electrodes and disposed on an outer surface of the component main body; wherein the external terminal electrode includes a first plating layer provided directly on the exposed surfaces of the plurality of internal electrodes in the component main body, and a second plating layer provided on the first plating layer; and a water repellent agent filled in a gap between an end edge of the first plating film on the outer surface of the component main body and a section of the outer surface of the component main body on which the end edge of the first plating layer is located.