| 发明名称 | Multi-chip package and operating method thereof | ||
| 摘要 | A multi-chip package includes first and second semiconductor chips each configured to perform first and second operations having different current consumptions. The first and second semiconductor chips perform the first operation in response to an enable control signal transmitted from one of the first and second semiconductor chips to the other and transmitted from the other back to the one. | ||
| 申请公布号 | US9015392(B2) | 申请公布日期 | 2015.04.21 |
| 申请号 | US201213572086 | 申请日期 | 2012.08.10 |
| 申请人 | SK Hynix Inc. | 发明人 | Kang Won-Kyung;Won Sam-Kyu |
| 分类号 | G06F13/00;G11C5/14 | 主分类号 | G06F13/00 |
| 代理机构 | IP & T Group LLP | 代理人 | IP & T Group LLP |
| 主权项 | 1. A multi-chip package, comprising: first and second semiconductor chips each configured to perform first and second operations having different current consumptions, wherein the first and second semiconductor chips are configured to perform the first operation in response to an enable control signal transmitted from one of the first and second semiconductor chips to the other and transmitted from the other back to the one. | ||
| 地址 | Gyeonggi-do KR | ||