| 发明名称 | Semiconductor device manufacturing method and semiconductor device | ||
| 摘要 | A semiconductor device manufacturing method includes sealing a first surface of a semiconductor wafer with a resin, causing a resin-made warp suppression member to be adhered to a second surface on the opposite side of the first surface of the semiconductor wafer and causing the warp suppression member to shrink, measuring the amount of warp of the semiconductor wafer, and forming cuts in the warp suppression member in accordance with the amount of warp of the semiconductor wafer. | ||
| 申请公布号 | US9013048(B2) | 申请公布日期 | 2015.04.21 |
| 申请号 | US201414193128 | 申请日期 | 2014.02.28 |
| 申请人 | Fujitsu Limited | 发明人 | Kainuma Norio |
| 分类号 | H01L21/66;H01L23/31 | 主分类号 | H01L21/66 |
| 代理机构 | Squire Patton Boggs (US) LLP | 代理人 | Squire Patton Boggs (US) LLP |
| 主权项 | 1. A semiconductor device manufacturing method comprising: sealing a first surface of a semiconductor wafer with a resin; causing a resin-made warp suppression member to be adhered to a second surface on the opposite side of the first surface of the semiconductor wafer, and causing the warp suppression member to shrink; measuring the amount of warp of the semiconductor wafer; and forming cuts in the warp suppression member in accordance with the amount of warp of the semiconductor wafer. | ||
| 地址 | Kawasaki JP | ||