Multiple die face-down stacking for two or more die

摘要

A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

主权项

1. A microelectronic assembly, comprising:
a substrate having:
first and second opposed surfaces each extending in first and second transverse directions;a peripheral edge extending between the first and second surfaces and in the second direction;first and second openings extending between the first and second surfaces, each of the openings having an elongated first dimension extending in the first direction, and a second dimension in the second direction shorter than the first dimension; anda peripheral region of the second surface extending between the peripheral edge and one of the openings; a first microelectronic element having a front surface facing toward the first surface and bond pads at the front surface aligned with the first opening, a rear surface opposite from the front surface, and an edge extending between the front and rear surfaces; a second microelectronic element having a front surface facing toward the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening; and a plurality of terminals exposed at the second surface and electrically connected with the bond pads of the first and second microelectronic elements, the terminals configured for connecting the microelectronic assembly to at least one component external to the assembly, at least one of the terminals being disposed at least partially within the peripheral region such that a straight line extending in the first direction and passing through the at least one terminal passes through or over at least one of the openings, wherein the bond pads of the first and second microelectronic elements are electrically connected to conductive elements of the substrate, wherein the bond pads of the first microelectronic element are electrically connected to the conductive elements by first leads having portions aligned with the first opening, and the bond pads of the second microelectronic element are electrically connected to the conductive elements by second leads having portions aligned with the second opening, wherein the edge of the first microelectronic element is a first edge and the first microelectronic element has a second edge opposite therefrom, wherein the second microelectronic element has first and second opposed edges, and wherein each microelectronic element has at least one row of five or more of the bond pads extending in the first direction in a central region of the front surface thereof, each central region extending a middle third of a distance between the respective first and second edge, and wherein at least one of: the first leads do not extend through the first opening, or the second leads do not extend through the second opening.