Method for making image sensors using wafer-level processing and associated devices

摘要

A method of making image sensor devices may include forming a sensor layer including image sensor ICs in an encapsulation material, bonding a spacer layer to the sensor layer, the spacer layer having openings therein and aligned with the image sensor ICs, and bonding a lens layer to the spacer layer, the lens layer including lens in an encapsulation material and aligned with the openings and the image sensor ICs. The method may also include dicing the bonded-together sensor, spacer and lens layers to provide the image sensor devices. Helpfully, the method may use WLP to enhance production.

主权项

1. A method of making a plurality of image sensor devices comprising:
forming a sensor layer comprising a plurality of image sensor integrated circuits (ICs) in an encapsulation material; bonding a spacer layer to the sensor layer, the spacer layer having a plurality of openings therein and aligned with the plurality of image sensor ICs; bonding a lens layer to the spacer layer, the lens layer comprising a plurality of lenses in an encapsulation material and aligned with the plurality of openings and the plurality of image sensor ICs; and dicing the bonded-together sensor, spacer and lens layers to provide the plurality of image sensor devices.