发明名称 |
Thin-film transistor and method for manufacturing thin-film transistor |
摘要 |
A method for manufacturing a thin-film transistor includes: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, a protective layer comprising an organic material; forming a source electrode and a drain electrode which are opposed to each other and each of which has at least a portion located above the protective layer; forming a semiconductor layer patterned, by performing dry etching on the semiconductor film; and performing, in a hydrogen atmosphere, plasma treatment on an altered layer which (i) is a surface layer of the protective layer exposed from the source electrode and the drain electrode and altered by the dry etching, and (ii) has at least a portion contacting a surface of the semiconductor layer. |
申请公布号 |
US9012914(B2) |
申请公布日期 |
2015.04.21 |
申请号 |
US201314130941 |
申请日期 |
2013.05.29 |
申请人 |
Panasonic Corporation |
发明人 |
Kishida Yuji;Nishida Kenichirou;Matsumoto Mitsutaka |
分类号 |
H01L29/10;H01L21/00;H01L27/12;H05B33/08;H01L29/66;H01L29/786;H01L27/32 |
主分类号 |
H01L29/10 |
代理机构 |
Greenblum & Bernstein, P.L.C. |
代理人 |
Greenblum & Bernstein, P.L.C. |
主权项 |
1. A thin-film transistor, comprising:
a gate electrode above a substrate; a gate insulating layer above the gate electrode; a semiconductor layer that is opposed to the gate electrode with the gate insulating layer therebetween; an etch-stopper layer above the semiconductor layer and comprising an organic material; and a source electrode and a drain electrode that are opposed to each other, each of the source electrode and the drain electrode having at least a portion located above the etch-stopper layer, wherein the etch-stopper layer includes a modified layer in a region which (i) is in a surface of the etch-stopper layer exposed from the source electrode and the drain electrode and (ii) has at least a portion contacting a surface of the semiconductor layer, the modified layer being an altered layer that has been modified, the altered layer being generated by alteration of a material of the etch-stopper layer, and wherein the modified layer has a chlorine concentration which is at least ten times higher than a chlorine concentration of the etch-stopper layer. |
地址 |
Osaka JP |