Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same

摘要

A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.

主权项

1. A joined body, wherein
an anti-corrosion film for oxidation inhibition is formed on a side surface, and around, a junction portion in which a first junction target member and a second junction target member each made of a metal are directly joined.