Printed circuit board with embedded heater

摘要

Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.

主权项

1. A printed circuit board comprising:
a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a plurality of heater layers interposed between the top conductive layer and the bottom conductive layer, wherein at least one heater layer of the plurality of heater layers is:
separate from and not disposed on or integrated into the top conductive layer or the bottom conductive layer;configured to generate and transfer heat to at least one of the electronic components;wherein the each heater layer of the plurality of heater layers comprises:
an input via;an output via;a substrate; anda conductive pattern located on the substrate and configured to generate heat according to a driving signal, the conductive pattern being electrically coupled between the input via and the output via; andwherein the plurality of heater layers comprises:
a horizontal heating layer comprising a horizontal conductive pattern, the horizontal conductive pattern comprising a plurality of conductive traces arranged in substantially parallel lines along a horizontal direction of the printed circuit board and electrically coupled in series between the input via and the output via of the horizontal heating layer by a plurality of connecting traces, a vertical heating layer comprising a vertical conductive pattern, the vertical conductive pattern comprising another plurality of conductive traces arranged in substantially parallel lines along a vertical direction of the printed circuit board and electrically coupled in series between the input via and the output via of the vertical heating layer by another plurality of connecting traces, and the horizontal heating layer and the vertical heating layer are arranged so that one of the horizontal heating layer or the vertical heating layer overlaps the other to form a heater grid.