Consolidated thermal module

摘要

A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

主权项

1. A consolidated thermal module (CTM) used to secure an integrated circuit (IC) to a socket disposed on a first surface of a printed circuit board (PCB) and to maintain the IC in thermal contact with a heat removal assembly comprising:
a stiffener plate disposed on a second surface of the PCB; a retaining mechanism disposed on the stiffener plate; and at least one fastener used to secure the heat removal assembly to the stiffener plate and the retaining mechanism, wherein the retaining mechanism evenly distributes a retaining force across the stiffener plate that maintains the IC in uniform electrical contact with electrical contacts within the socket and maintains the IC in thermal contact with the heat removal assembly.