Electronic apparatus having a module protection buffer

摘要

According to one embodiment, an electronic apparatus includes a housing, a module including a fixing portion, and a supporting portion configured to support the module. The supporting portion includes a portion configured to receive stress from the housing at an outer region relative to the fixing portion.

主权项

1. An electronic apparatus comprising:
a housing; a module comprising a side surface; a holder comprising a plate portion along the side surface and configured to hold the module; a first screw configured to attach the holder to the module, the first screw protruding from the module in a direction crossing a thickness direction of the module; and a first buffer on the holder, the first buffer comprising a first portion which is a plate portion extending from the plate portion of the holder in the thickness direction of the module to protrude outside the module, and a second portion which is an end portion of the first portion in the thickness direction of the module, the end portion being bent to protrude outwardly beyond the first screw, in a direction of protrusion of the first screw, the second portion configured to contact the housing before the first screw at a position not overlapping the side surface of the module, wherein:
the housing comprises an accommodation portion configured to accommodate the module, the accommodation portion comprising a cover configured to cover the accommodation portion and further comprising a wall opposite the cover, andthe first buffer is bendable in a direction opposite to the direction of protrusion of the first screw to be in a space between the module and the wall opposite the cover, or in a space between the cover and the module, when the first buffer contacts the housing.