Semiconductor element applicable to optical products

摘要

A semiconductor element includes: a transparent substrate; a stack structure formed on the transparent substrate and having a metal oxide layer partially exposed through sidewalls of the stack structure; a plurality of leads spacingly formed on the stack structure and extending to the sidewalls of the stack structure; an insulating film covering the exposed portions of the metal oxide layer; a metal film formed on the leads; and a solder mask layer disposed on the metal film, the stack structure and the insulating film. As such, the insulating film prevents short circuits from occurring between adjacent leads so as to improve the product yield.

主权项

1. A semiconductor element, comprising:
a transparent substrate; a stack structure disposed on the transparent substrate, wherein the stack structure comprises a metal oxide layer, an adhesive layer and a semiconductor layer sequentially stacked on the transparent substrate and a plurality of grooves are disposed in the stack structure such that portions of the metal oxide layer are exposed through sidewalls of the grooves, and wherein a plurality of recesses are formed in the transparent substrate and in respective communication with the bottoms of the grooves; a plurality of leads spacingly disposed on a top surface of the stack structure and extending to the sidewalls of the grooves; an insulating film covering the exposed portions of the metal oxide layer, but not covering the entire sidewalls of the grooves; a metal film disposed on the leads; and a solder mask layer disposed on the metal film, the top surface of the stack structure and the insulating film and in the grooves, wherein a plurality of openings are disposed in the solder mask layer for exposing portions of the metal film on the leads on the top surface of the stack structure.