| 摘要 |
<p>According to an embodiment of the present invention, a MEMS module package comprises: a lower substrate; a MEMS element which is mounted on the lower substrate; and a capping unit which surrounds the MEMS element. The capping unit comprises: a first capping unit which is placed in the edge of the lower substrate; a second capping unit which is placed in the first capping unit in order to cover the lower substrate; and an attaching unit which attaches the first capping unit to the second capping unit. An indicating layer is placed between the first capping unit and the second capping unit According to an embodiment of the present invention, a manufacturing method for a MEMS module comprises: a step of mounting a MEMS element in a lower substrate; and a step of placing a capping unit for surrounding the MEMS element. The step of placing a capping unit includes: a step of preparing a first capping unit which includes a first insulating substrate and a first metal layer; a step of preparing a second capping unit which includes a second insulating substrate and a second metal layer; a step of forming an indicating layer by etching at least one between a first metal layer and a second metal layer; and a step of bonding the first capping unit to the second capping unit and placing it on the lower substrate.</p> |
