| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip structure capable of radiating heat and elongating the chip life.SOLUTION: A semiconductor chip structure comprises a pair of electrodes 200. The pair of electrodes 200 have different conductivity types for electrical connection. Thermoelectric cooling material layers 210 and 220 are arranged in respective P-type and N-type electrodes 200. Low-temperature ends of the thermoelectric cooling material layers 210 and 220 approach a surface of a semiconductor chip 100 that is close to a thermal conductive layer 110, and heat is transmitted from the inside of the semiconductor chip structure to the low-temperature ends of the thermoelectric cooling material layers 210 and 220. |
