| 摘要 |
<p>An apparatus for bending a multi-layer ceramic capacitors array plate is provided to easily bend a multi-layer ceramic capacitors array plate having cutting lines that divide multi-layer ceramic capacitors, and to easily distinguish the areas of multi-layer ceramic capacitors that are close to each other, with the multi-layer ceramic capacitors array plate bent at random cutting lines. The present invention comprises: a base member where a multi-layer ceramic capacitors array plate having cutting lines is placed; a work fixing unit that supports one top side of the multi-layer ceramic capacitors array plate based on the cutting line of the multi-layer ceramic capacitors array plate placed on the base member; a sliding member mounted on the base member to be able to move straight, supporting one bottom side of the multi-layer ceramic capacitors array plate and pushing upwards a part of the multi-layer ceramic capacitors array plate with a pushing bump; a sliding member driving unit that moves the sliding member; and a roller assembly having a roller that bends the multi-layer ceramic capacitors array plate by pressing downwards the other side of the multi-layer ceramic capacitors array plate.</p> |
