FRAME REINFORCEMENT MATERIAL FOR SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a frame reinforcement material for a semiconductor package that has a high rigidity against warpage and deformation of a substrate, a high durability, and a high heat resistance, and to provide a method of manufacturing a semiconductor package using the same.SOLUTION: A frame reinforcement material 200 for a semiconductor package includes: a main body part 201 adhered onto a substrate in a plate-like rectangular frame body shape; many rectangular hole-like reinforcement parts 202 formed in the main body part 201 so that a unit substrate in the substrate is exposed; and a frame body 203 provided among the many reinforcement parts 202. A width of the frame body 203 is set to be narrower than a width that is cut at a sawing step.