| 摘要 |
<p>The present invention relates to a heat resistant adhesive masking tape with improved adhesion for a semiconductor process and, more specifically, to a heat resistant adhesive masking tape with improved adhesion for a semiconductor process which enables lamination on a lead frame by expressing adhesion only during a heating lamination process while an adhesive layer does not have adhesion at room temperature, exhibits excellent heat resistance on thermal history that an adhesive tape is exposed during a manufacture process of a semiconductor, is capable of improving reliability during manufacture of a semiconductor device with excellent adhesion, is capable of preventing the leakage of sealing materials and is capable of preventing the appearance defects and adhesive transfer of the sealing materials or the lead frame when a tape is removed after process completion.</p> |
