| 摘要 |
<p>Disclosed are a bump including a barrier layer and a light emitting device including the same. The light emitting device includes a secondary substrate, a light emitting structure which is located on the secondary substrate and includes a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer which is interposed between the first and second conductive semiconductor layers, and a first bump and a second bump which are located between the secondary substrate and the light emitting structure and are electrically connected to the first conductive semiconductor layer and the second conductive semiconductor layer. The first bump and the second bump includes top bump layers, bottom bump layers, and barrier layers which are located between the top bump layer and the bottom bump layer. Thereby, the long-term reliability of the light emitting device is improved.</p> |
