| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a mold package, capable of preventing a mold resin from adhering to a side surface of a sensor chip.SOLUTION: In a first step, a workpiece comprising a lead frame 4 is prepared. The lead frame 4 includes: a circuit chip 2; a sensor chip 3; an island portion 4a; and a sensor chip support 4c. In a second step, the workpiece is disposed on a mold 9 in a state where the sensor chip 3 is sandwiched between an upper mold 9a and a lower mold 9b, and a resin film 10 is arranged between the lower mold 9b and the sensor chip 3. In a third step, the island portion 4a is sealed with a mold resin 6 so that a second end 3b of the sensor chip 3 is protruded from the mold resin 6. In this state, the mold resin 6 is cast into a cavity 91 through between the lower mold 9b and a second surface 10b opposite to a surface facing the sensor chip 3, of the resin film 10. Thus, it is possible to prevent the mold resin 6 from adhering to a side surface 3e of the sensor chip 3. |
