| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which reduces the costs and warpage of an entire substrate, stabilizes the quality, and improves the reliability, and to provide a manufacturing method of the power module.SOLUTION: A power module 20 includes: an insulation layer 12; a first metal plate 3 disposed on the insulation layer 12; a first semiconductor device 1 disposed on the first metal layer 3; a first adhesion insulation layer 10 and a second adhesion insulation layer 11 which are disposed on the first metal plate 3; a first main electrode wiring land 5 disposed on the first adhesion insulation layer 10; and first signal wiring lands 7, 7disposed on the second adhesion insulation layer 11. |
