| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component capable of manufacturing an electronic component, where a plurality of device chips are integrated as one chip, in good yield.SOLUTION: At first, a plurality of device chips 14a, 14b are arranged in a formwork 13, while directing the electrode formation surface of the device chips 14a, 14b downward. Subsequently, a mold resin 15 is injected into the formwork 13, and cured to produce a pseudo wafer 10. Thereafter, the pseudo wafer 10 is removed from the formwork 13, and cuts 16 are formed in the pseudo wafer 10. Finally, re-wiring is formed on the pseudo wafer 10, and the pseudo wafer 10 is cut into individual electronic components. |
