| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which can reduce a stress acting on a solder bump.SOLUTION: A semiconductor device manufacturing method comprises the steps of: preparing a semiconductor chip 30 with an electrode pad 32 being formed; forming on the electrode pad 32, a low-wettability part 36 having low wettability against a solder; printing a flux-containing solder paste 40a so as to cover an apex 36a of the low-wettability part 36; and forming a solder bump 40b to be electrically connected with the electrode pad 32 by performing reflow treatment on the solder paste 40, in which a void 41 is formed in the solder bump 40 by contact and stay of a gas generated from the flux on the apex 36a of the low-wettability part 36.</p> |
