SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil and a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same, which are capable of improving adhesive strength between a base and a copper-clad layer even without treating a roughed surface and capable of improving reliability of the printed circuit board having a circuit pattern.SOLUTION: A copper-clad laminate plate 3 includes: a carrier 30; a peel layer 40 formed on the carrier 30; a copper foil layer 10 formed on the peel layer 40; and a surface-treated layer 20 formed on the copper foil layer 10. The surface-treated layer 20 contains a thiol-based compound.