| 摘要 |
<p>According to the present invention, the present invention provides a method for manufacturing a single layer PCB which includes the steps of: providing a carrier; stacking a first insulation layer on the upper and lower sides of the carrier and forming a first hole on the stacked first insulation layer; forming a first via and a circuit pattern by stacking a first plating layer on the first insulation layer and the first hole; stacking a second insulation layer on the circuit pattern and the first insulation layer and forming a second hole on the upper side of the circuit pattern; forming a second via by stacking a second plating layer on the second hole; and removing the carrier.</p> |
