发明名称 |
METHOD FOR MANUFACTURING ELECTRICAL APPARATUS AND ELECTRICAL APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To prevent a resin from adhering to a resin injection nozzle in a resin sealing process for embedding a printed board in a case with the resin.SOLUTION: An electrical apparatus 1 includes: a case 2 which has a bottom 3 and side parts 4, 5 and opens upwardly; a printed board 10 including a resin injection hole 11 penetrating through in a thickness direction thereof; and a spacer member 6 having a tubular resin dam part 7 with a predetermined height. A method for manufacturing the electrical apparatus 1 includes the steps of: arranging the resin dam part 7 of the spacer member 6 on the upper face of the printed board 10; placing the printed board 10 in the case 2 so that a lower face 10b of the printed board 10 faces an inner face 3a of the bottom 3 of the case 2; and inserting a tip 51 of a resin pouring nozzle 50 into the resin dam part 7 and injecting the resin poured through the resin pouring nozzle 50 into an internal space S via the spacer member 6 and the resin injection hole 11, the internal space S being defined by the case 2 and the printed board 10. |
申请公布号 |
JP2015076580(A) |
申请公布日期 |
2015.04.20 |
申请号 |
JP20130213772 |
申请日期 |
2013.10.11 |
申请人 |
SHINDENGEN ELECTRIC MFG CO LTD |
发明人 |
AKASHI TOMOYA |
分类号 |
H05K3/28;H01L21/56;H05K5/00 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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