发明名称 DIVIDING METHOD FOR CIRCULAR PLATE-SHAPED OBJECTS
摘要 <p>PROBLEM TO BE SOLVED: To prevent scattering of chips during cutting work without entailing extra cost or man-hours.SOLUTION: A dividing method for a circular plate-shaped object (W) comprises: positioning first planned division lines (51) in the cutting feed direction and cutting-feeding the circular plate-shaped object from one end to just before the other end relative to each first planned division line in a half surface size area (57A) resulting from bisecting in a first direction; turning the circular plate-shaped 180° and cutting-feeding it from one end to just before the other end relative to each first planned division line in the remaining half surface size area (57B); positioning second planned division lines (52) in the cutting feed direction and cutting-feeding the circular plate-shaped from one end to just before the other end relative to each second planned division line in a half surface size area (57C) resulting from bisecting in a second direction; and turning the circular plate-shaped turned 180° and cutting-feeding it from one end to just before the other end relative to each second planned division line in the remaining half surface size area (57D).</p>
申请公布号 JP2015076561(A) 申请公布日期 2015.04.20
申请号 JP20130213283 申请日期 2013.10.11
申请人 DISCO ABRASIVE SYST LTD 发明人 SUZUKI MINORU
分类号 H01L21/301;B24B27/06 主分类号 H01L21/301
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