发明名称 WAFER TRANSFER APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To prevent a wafer from shifting in position when placed, in a case that the wafer is sucked and held not in contact.SOLUTION: A wafer transfer device 1 which includes a sucking and holding mechanism 10 for sucking and holding a wafer, and transfers the wafer held by the sucking and holding mechanism 10 from a first position to a second position, includes: at least three pins 13 which are made to abut on an outer peripheral edge of the wafer sucked and held by a non-contact sucking and holding part 30; and moving means 27 of moving at least the three pins 13 radially by an equal distance. The three pins 13 which are made to abut on the outer peripheral edge of the wafer sucked and held by a non-contact sucking and holding part 30, have their center of gravity in the center of the wafer to restrict the wafer from laterally shifting in position, and the wafer is transferred from the first position to the second position and released from being sucked and held by the non-contact sucking and holding part 30 to be placed at the second position along side walls of the pins 13. Consequently, the wafer is prevented from shifting in position and can be centered and transferred.</p>
申请公布号 JP2015076469(A) 申请公布日期 2015.04.20
申请号 JP20130210958 申请日期 2013.10.08
申请人 DISCO ABRASIVE SYST LTD 发明人 KADOTA KOTARO
分类号 H01L21/677;B25J15/06;B65G49/07 主分类号 H01L21/677
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