| 摘要 |
<p>According to the present invention, provided is a method for manufacturing a PCB which includes a heating step of desorbing a bonding member from a pair of substrates by heating the pair of substrates and the bonding member which is inserted between the pair of substrates and is temporarily bonded to the pair of substrates, a first separation step of separating and moving the desorbed top substrate by absorbing the desorbed top substrate by a first absorber, and a second separation step of separating and moving the bonding member by absorbing the bonding member by a second absorber.</p> |
