| 摘要 |
<p>The present invention relates to a printed circuit board and a manufacturing method thereof. The printed circuit board according to one embodiment of the present invention includes an insulation layer and a circuit layer which includes a film which is inserted into the insulation layer in a longitudinal direction and a via which is formed on the insulation layer. The film is a dry film photoresist. The via is formed with a taper shape. Blind via holes are formed on both sides of the insulation layer.</p> |
