| 摘要 |
<p>The present invention relates to a frame stiffener for a semiconductor package and a method for manufacturing the semiconductor package using the same. The frame stiffener for the semiconductor package according to one embodiment of the present invention includes a body part which is attached to a substrate with a planar square frame shape, a plurality of stiffener parts with square hole shapes which are formed on the body part to expose a unit substrate on the substrate, and a frame between the stiffeners. The width of the frame is narrower than a cutting width in a sawing process.</p> |
