SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can improve electrical connection reliability between a semiconductor chip and a circuit board while improving heat dissipation performance.SOLUTION: A semiconductor device 10 comprises: a circuit board 12; a mounting part 14 arranged at a distance from the circuit board 12; a semiconductor chip 18 fixed to an opposed surface 14a of the mounting part 14 against the circuit board 12; a support part 16 for supporting the mounting part 14 with the semiconductor chip 18 being fixed in a state of floating on the circuit board 12 and electrically relaying the semiconductor chip 18 and the circuit board 12; and an encapsulation resin part 20 for integrally encapsulating the mounting part 14 and the semiconductor chip 18 together with a surface of the circuit board 12.