摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board that has high product reliability by suppressing generation of cracks between via conductors constituting a via conductor group.SOLUTION: The ceramic wiring board includes: a board body; a first surface side electrode pad 24 arranged on a first surface of the board body; a second surface side electrode pad arranged on a second surface of the board body; and a via array 28 comprising a plurality of via conductors 27 connecting the first surface side electrode pad 24 and the second surface side electrode pad. The via array 28 comprises a plurality of outer via conductors 27a arranged on an outermost periphery, and a plurality of inner via conductors 27b surrounded by the plurality of outer via conductors 27a. A ratio of presence of the outer via conductors 27a occupying an outer region R1 is lower than a ratio of presence of the inner via conductors 27b occupying an inner region R2. |