| 摘要 |
<p>The present invention relates to a prepreg for printed circuit board, a manufacturing method thereof, and a printed circuit board including the same. Particularly, in the prepreg for printed circuit board, a manufacturing method thereof, and a printed circuit board including the same according to this invention include: a phase of making an insulating layer by coating two carrier films respectively with insulation composition, and then drying the layer and forming a first carrier substrate and a second carrier substrate; a phase of forming a laminated substrate by placing glass fiber between the insulating layers of the first carrier substrate and the second carrier substrate and bonding the first carrier substrate and the second carrier substrate; a phase for pressuring the laminated substrate; and a phase for removing the carrier films from the pressed laminated substrates. By this method, the manufacturing of a thin prepreg for a printed circuit board can be possible, the stability of thickness quality can be obtained as the thickness for the prepreg can be manufactured as desired or the thickness can be consistent, resulting in improvement in the coefficient of thermal expansion.</p> |
