| 摘要 |
<p>The prevent invention provides a surface-treated copper foil, a copper clad laminate comprising the same, a printed circuit board using the same and a manufacturing method thereof. Specifically, the copper clad laminate according to one specific embodiment of the present invention comprises: a carrier; a delamination layer formed on the carrier; a copper clad layer formed on the delamination layer; and a surface-treated layer formed on the copper-clad layer and containing thiol compound. As such, the present invention provides a printed circuit board which enhances adhesion between a base and a copper clad layer without treating a roughened surface by forming a surface-treated layer on a copper-clad layer.</p> |
