发明名称 METHOD FOR FORMING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a novel method for forming a pattern, excellent in etching resistance against chlorine-based gas when a photocurable nanoimprint composition is used in dry etching of a substrate such as sapphire.SOLUTION: A method for forming a pattern includes the steps of: applying a photocurable nanoimprint composition on a substrate, the photocurable nanoimprint composition containing a hydrolysis mixture (A) including hydrolysate of an organosilicon compound having a (meth)acrylic group and hydrolysate of a specific metal alkoxide, a polymerizable monomer (B) having a (meth)acrylic group, and a photoinitiator (C), and then drying the composition at a temperature of 150-250°C to form a coating film comprising the composition; bringing the coating film in contact with a pattern formation surface of a mold having a pattern formed thereon and irradiating the coating film with light in such a state to cure the coating film; and separating the mold from the cured coating film and forming a pattern corresponding to the pattern formed on the pattern formation surface of the mold, on the substrate.
申请公布号 JP2015076512(A) 申请公布日期 2015.04.20
申请号 JP20130211854 申请日期 2013.10.09
申请人 TOKUYAMA CORP 发明人 UMEKAWA HIDEKI
分类号 H01L21/027;B29C59/02;C08F2/44 主分类号 H01L21/027
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