| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that can print an identification symbol with good visibility on a semiconductor wafer while suppressing a decrease in manufacturing efficiency.SOLUTION: A method of manufacturing a semiconductor device includes the processes of: preparing a silicon single-crystal wafer 1 where radiation damage is left; and printing on the silicon single-crystal wafer 1 by irradiating a laser print region 3 where radiation damage is left on one main surface 1a of the silicon single-crystal wafer 1 with laser light from a laser light source 4 different from a heater 5 while heating the laser print region 3 by the heater 5. |
