发明名称 HOT MELT ADHESIVE
摘要 <p>PROBLEM TO BE SOLVED: To provide a hot melt adhesive that can maintain excellent adhesive strength even in a low temperature environment, and can form an adhesive layer that causes cohesive failure and can partially remain when peeling off a label.SOLUTION: A hot melt adhesive contains: 100 pts.wt. of a styrene-based thermoplastic elastomer (A) selected from the group consisting of a styrene-butadiene block copolymer, a styrene-isoprene block copolymer, a styrene-isoprene-styrene block copolymer, and a styrene-butadiene-styrene block copolymer; 60-350 pts.wt. of a tackifying resin (B); and 10-135 pts.wt. of a plasticizer (C) containing at least one of a phthalate ester and an aliphatic dibasic acid ester and having a solidifying point of -40°C or less.</p>
申请公布号 JP2015074713(A) 申请公布日期 2015.04.20
申请号 JP20130211471 申请日期 2013.10.08
申请人 SEKISUI FULLER CO LTD 发明人 MURAMOTO TEI;NAKAHARA HIDETAKA
分类号 C09J125/10;C09J11/06;C09J11/08;C09J109/06;C09J193/04 主分类号 C09J125/10
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