| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for an electronic part having an excellent filling property and an excellent ion migration resistance after curing, and a method of producing the same, and an electronic part device.SOLUTION: A liquid resin composition for an electronic part comprises epoxy resin, cyclic acid anhydride that is liquid at 25°C, and a particle with a core-shell structure, and has a viscosity at 25°C of 1.2 Pa s or less measured by using an EMD type rotary viscometer. |
