INTEGRATED DEVICE WITH DEFINED HEAT FLOW

摘要

An integrated device includes at least one heat generating component which generates heat when operated, at least one temperature-sensitive component, and one or more hollow insulation regions arranged between the at least one heat generating component and the at least one temperature-sensitive component. The hollow insulation region may be provided as a vacuum gap.

主权项

1. Method for fabricating an integrated device, comprising the steps of:
providing a substrate having one or more components; forming a number of through-vias through a substrate layer; applying a low-pressure atmosphere or a vacuum environment on the substrate layer; hermetically closing at least one of the through-vias to obtain an insulation region, and providing electrical conductive material to the substrate to fill the not hermetically closed through-vias to form through-via interconnects.