| 发明名称 |
Die and Chip |
| 摘要 |
A die according to an embodiment includes a contact pad configured to provide an electrical contact to a circuit element included in the die, a lateral edge closest to the contact pad and a cover layer including a protective structure, the protective structure including at least one elongated structure, wherein the cover layer includes an opening providing access to the contact pad to couple the contact pad electrically to an external contact, wherein the protective structure is arranged between the lateral edge and the contact pad. Using an embodiment may reduce a danger of contamination of a top side of a die during fabrication and packaging a chip. |
| 申请公布号 |
US2015102493(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
US201314054931 |
申请日期 |
2013.10.16 |
| 申请人 |
INFINEON TECHNOLOGIES AUSTRIA AG |
发明人 |
Knuepfer Bernhard |
| 分类号 |
H01L23/00;H01L23/48 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A die comprising:
a contact pad configured to provide an electrical contact to a circuit element comprised in the die; a lateral edge closest to the contact pad; and a cover layer comprising a protective structure, the protective structure comprising at least one elongated structure, wherein the protective structure is arranged between the lateral edge and the contact pad, wherein the protective structure is configured to cause a modulation of a profile of a top surface of the die along a direction perpendicular to the lateral edge. |
| 地址 |
VILLACH AT |
