发明名称 |
MIXED ABRASIVE POLISHING COMPOSITIONS |
摘要 |
The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are ceria particles, second abrasive particles, wherein the second abrasive particles are ceria particles, surface-modified silica particles, or organic particles, a pH-adjusting agent, and an aqueous carrier. The polishing compositions also exhibit multimodal particle size distributions. |
申请公布号 |
WO2015053985(A1) |
申请公布日期 |
2015.04.16 |
申请号 |
WO2014US58268 |
申请日期 |
2014.09.30 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
REISS, BRIAN;NALASKOWSKI, JAKUB;LAM, VIET;JIA, RENHE;DYSARD, JEFFREY |
分类号 |
C09K3/14 |
主分类号 |
C09K3/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|