PRINTED WIRING BOARD, MANUFACTURING METHOD OF PRINTED WIRING BOARD, AND PACKAGE-ON-PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board which improves the connection reliability between the printed wiring board and an upper substrate mounted on the printed wiring board.SOLUTION: A first pad 710 is exposed from a solder resist layer 70F to allow an IC chip 90 to be positioned in a cavity 70FA and reduce a distance between the first pad and the IC chip. The structure allows a height of a metal post 77 to be reduced and improves the connection reliability between an upper substrate 110 and the metal post 77.