RESIN COMPOSITION, PREPREG USING THE SAME, METAL FOIL WITH RESIN, ADHESIVE FILM, AND METAL-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition that can form a product with excellent moldability, low reduction in cured elongation, the ability to fold when formed into a printed circuit board, and can be housed at high density in an electronic device package.SOLUTION: A resin composition comprises polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain. The positional relationship of the two nearest carboxyl groups means the positional relationship in which the carbon atoms on which the carboxyl groups are bonded are separated by at least one carbon atom.