发明名称 LINEAR HIGH PACKING DENSITY FOR LED ARRAYS
摘要 Apparatus for providing energy to a process chamber are provided herein. In one embodiment, the apparatus include a supporting substrate, a first plurality of solid state light sources disposed on a first surface of the supporting substrate, and a second plurality of solid state light sources disposed on the top surface of the supporting substrate, wherein the first and second plurality of solid state light sources are aligned and electrically isolated from each other, and the first plurality of solid state light sources is in physical contact with the second plurality of solid state light sources.
申请公布号 WO2015053866(A1) 申请公布日期 2015.04.16
申请号 WO2014US52349 申请日期 2014.08.22
申请人 APPLIED MATERIALS, INC. 发明人 JOHNSON, JOSEPH, R.;RANISH, JOSEPH, M.
分类号 H01L21/324;H01L21/02 主分类号 H01L21/324
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