| 摘要 |
<p>This molded package is provided with a semiconductor chip (10), and a molding resin (20), which seals a first portion (1) of the semiconductor chip. A second portion (2), which is the rest of the semiconductor chip, is exposed from the molding resin. At a boundary section (3) between the first portion and the second portion, a wall surface (21) that extends, from the boundary section, in the direction intersecting a surface of the semiconductor chip is formed as a part of the molding resin. A wall surface part on the boundary section side, said wall surface part including at least a contact section in contact with the boundary section, has a curved surface shape that is curved to protrude in the intersecting direction.</p> |
