| 摘要 |
<p>A chip on film (COF) package structure of a drive circuit comprises: a whole flexible printed circuit board (50), one side of which is jointed to a frame region (12) of a glass substrate of a liquid crystal display, the whole flexible printed circuit board being used as a carrier of a COF flexible package; multiple drive chips (30, 60), sequentially jointed to the whole flexible printed circuit board (50) in a scan direction, a signal circuit between adjacent drive chips (30, 60) being disposed on the whole flexible printed circuit board (50). Also provided is a liquid crystal display with a super narrow frame, which comprises the COF package structure of a drive circuit. By using a whole flexible printed circuit board (50), a signal circuit required between drive ICs (30, 60) is transferred from a glass substrate to a COF flexible circuit board, which can avoid a voltage drop caused by an increased resistance during wiring between drive ICs (30, 60) during design of a large-sized narrow frame, and avoid panel mura caused by a voltage drop of an input voltage input to the drive ICs of a narrow-frame large-sized panel, thereby improving the product quality.</p> |
