| 发明名称 |
APPARATUS, DEVICE AND METHOD FOR WAFER DICING |
| 摘要 |
An apparatus, device and method for wafer dicing is disclosed. In one example, the apparatus discloses: a wafer holding device having a first temperature; a die separation bar moveably coupled to the wafer holding device; and a cooling device coupled to the apparatus and having a second temperature which enables the die separation bar to fracture an attachment material in response to movement with respect to the wafer holding device. In another example, the method discloses: receiving a wafer having an attachment material applied to one side of the wafer; placing the wafer in a holding device having a first temperature; urging a die separation bar toward the wafer; and cooling the attachment material to a second temperature, which is lower than the first temperature, until the attachment material fractures in response to the urging. |
| 申请公布号 |
US2015104931(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
US201314055188 |
申请日期 |
2013.10.16 |
| 申请人 |
NXP B.V. |
发明人 |
Lapke Martin;Buenning Hartmut;Moeller Sascha;Albermann Guido;Rohleder Thomas;Backer Heiko |
| 分类号 |
H01L21/78;B28D5/00 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for wafer dicing, comprising:
a wafer holding device having a first temperature; a die separation bar moveably coupled to the wafer holding device; and a cooling device coupled to the apparatus and having a second temperature which enables the die separation bar to fracture an attachment material in response to movement with respect to the wafer holding device. |
| 地址 |
Eindhoven NL |
