| 发明名称 |
Treating Copper Surfaces for Packaging |
| 摘要 |
A die has a top surface, and a metal pillar having a portion protruding over the top surface of the die. A sidewall of the metal pillar has nano-wires. The die is bonded to a package substrate. An underfill is filled into the gap between the die and the package substrate. |
| 申请公布号 |
US2015104903(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
US201414550337 |
申请日期 |
2014.11.21 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chang Chih-Horng;Kuo Tin-Hao |
| 分类号 |
H01L25/00;H01L23/00;H01L21/56 |
主分类号 |
H01L25/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
performing a chemical treatment on a metal pillar of a first package component to generate nano-wires on a sidewall of the metal pillar, wherein the nano-wires comprise a metal oxide. |
| 地址 |
Hsin-Chu TW |
