ELECTRONIC PART MANUFACTURING METHOD AND ELECTRONIC PART MANUFACTURED BY THE METHOD

摘要

The present invention provides a new method for manufacturing an electronic part, which is capable of reducing the number of steps of superpose-printing, achieving positional accuracy (alignment accuracy) of precise superposed patterns, and layering with substantially no difference in level, thereby improving productivity and dimensional accuracy and eliminating defects. The method for manufacturing an electronic part includes the steps of forming a composite ink pattern layer on a releasing surface of a transfer plate using a relief offset method, and then simultaneously reversely transferring the composite ink pattern layer to a printing object. Various organic transistor elements are formed by combining a conductive ink, an insulating ink, and an ink containing a semiconductor.

主权项

1. A composite ink pattern layer comprising:
(a) an ink pattern layer comprising a first functional material ink selected from the group consisting of: a conductive ink, an insulating ink, a semiconductor ink, and a protective film forming ink; wherein the first functional material ink is in contact with a mold releasing surface of a transfer plate, and the first functional material ink forms an ink pattern wherein the functional material ink is absent from a portion of the ink pattern; and (b) a second functional material ink selected from the group consisting of: a conductive ink, an insulating ink, a semiconductor ink, and a protective film forming ink; wherein the second functional material ink is laminated on the ink pattern layer so that the two layers are not mixed with each other.